Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography. / Mendioroz, Arantza; Salazar, Agustín; Oswald-Tranta, Beate et al.
Thermosense: Thermal Infrared Applications XLV. ed. / Nicolas P. Avdelidis. SPIE, 2023. 125360M (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12536).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Mendioroz, A, Salazar, A, Oswald-Tranta, B & Tuschl, C 2023, Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography. in NP Avdelidis (ed.), Thermosense: Thermal Infrared Applications XLV., 125360M, Proceedings of SPIE - The International Society for Optical Engineering, vol. 12536, SPIE, Thermosense: Thermal Infrared Applications XLV 2023, Orlando, United States, 2/05/23. https://doi.org/10.1117/12.2663135

APA

Mendioroz, A., Salazar, A., Oswald-Tranta, B., & Tuschl, C. (2023). Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography. In N. P. Avdelidis (Ed.), Thermosense: Thermal Infrared Applications XLV Article 125360M (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12536). SPIE. https://doi.org/10.1117/12.2663135

Vancouver

Mendioroz A, Salazar A, Oswald-Tranta B, Tuschl C. Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography. In Avdelidis NP, editor, Thermosense: Thermal Infrared Applications XLV. SPIE. 2023. 125360M. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.2663135

Author

Mendioroz, Arantza ; Salazar, Agustín ; Oswald-Tranta, Beate et al. / Estimation of the area and depth of buried heat sources : an approach to characterize defects in inductive and ultrasound excited thermography. Thermosense: Thermal Infrared Applications XLV. editor / Nicolas P. Avdelidis. SPIE, 2023. (Proceedings of SPIE - The International Society for Optical Engineering).

Bibtex - Download

@inproceedings{ca8f5e31c3bc4322a7c1174fce4baada,
title = "Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography",
keywords = "delaminations, inductive thermography, infrared thermography, nondestructive evaluation, tilted cracks",
author = "Arantza Mendioroz and Agust{\'i}n Salazar and Beate Oswald-Tranta and Christoph Tuschl",
note = "Publisher Copyright: {\textcopyright} 2023 SPIE.; Thermosense: Thermal Infrared Applications XLV 2023 ; Conference date: 02-05-2023 Through 04-05-2023",
year = "2023",
doi = "10.1117/12.2663135",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Avdelidis, {Nicolas P.}",
booktitle = "Thermosense",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Estimation of the area and depth of buried heat sources

T2 - Thermosense: Thermal Infrared Applications XLV 2023

AU - Mendioroz, Arantza

AU - Salazar, Agustín

AU - Oswald-Tranta, Beate

AU - Tuschl, Christoph

N1 - Publisher Copyright: © 2023 SPIE.

PY - 2023

Y1 - 2023

KW - delaminations

KW - inductive thermography

KW - infrared thermography

KW - nondestructive evaluation

KW - tilted cracks

UR - http://www.scopus.com/inward/record.url?scp=85167405621&partnerID=8YFLogxK

U2 - 10.1117/12.2663135

DO - 10.1117/12.2663135

M3 - Conference contribution

AN - SCOPUS:85167405621

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Thermosense

A2 - Avdelidis, Nicolas P.

PB - SPIE

Y2 - 2 May 2023 through 4 May 2023

ER -

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