Effect of microstructure on electro-mechanical behavior of Cu films on polyimide
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Effect of microstructure on electro-mechanical behavior of Cu films on polyimide. / Berger, J.; Glushko, Oleksandr; Marx, Vera Maria et al.
In: JOM, 2016.
In: JOM, 2016.
Research output: Contribution to journal › Article › Research › peer-review
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Berger J, Glushko O, Marx VM, Kirchlechner C, Cordill M. Effect of microstructure on electro-mechanical behavior of Cu films on polyimide. JOM. 2016. doi: http://dx.doi.org/10.1007/s11837-016-1940-z
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Bibtex - Download
@article{c80e123dc8904c9da78321ce5611e06b,
title = "Effect of microstructure on electro-mechanical behavior of Cu films on polyimide",
author = "J. Berger and Oleksandr Glushko and Marx, {Vera Maria} and Christoph Kirchlechner and Megan Cordill",
year = "2016",
doi = "http://dx.doi.org/10.1007/s11837-016-1940-z",
language = "English",
journal = "JOM",
issn = "0148-6608",
publisher = "Minerals, Metals and Materials Society",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Effect of microstructure on electro-mechanical behavior of Cu films on polyimide
AU - Berger, J.
AU - Glushko, Oleksandr
AU - Marx, Vera Maria
AU - Kirchlechner, Christoph
AU - Cordill, Megan
PY - 2016
Y1 - 2016
U2 - http://dx.doi.org/10.1007/s11837-016-1940-z
DO - http://dx.doi.org/10.1007/s11837-016-1940-z
M3 - Article
JO - JOM
JF - JOM
SN - 0148-6608
ER -
