Dynamic Behavior of Thermally Affected Injection-Molded High-Density Polyethylene Parts Modified by Accelerated Electrons

Research output: Contribution to journalArticleResearchpeer-review

Authors

  • Ales Mizera
  • Lovre Krstulovic-Opara
  • Michaela Karhankova
  • Miroslav Manas
  • Lubomir Sanek
  • Pavel Stoklasek
  • Alen Grebo

Organisational units

External Organisational units

  • Tomas Bata University in Zlin
  • University of Split

Abstract

Polyethylenes are the most widely used polymers and are gaining more and more interest due to their easy processability, relatively good mechanical properties and excellent chemical resistance. The disadvantage is their low temperature stability, which excludes particular high-density polyethylenes (HDPEs) for use in engineering applications where the temperature exceeds 100 °C for a long time. One of the possibilities of improving the temperature stability of HDPE is a modification by accelerated electrons when HDPE is cross-linked by this process and it is no longer possible to process it like a classic thermoplastic, e.g., by injection technology. The HDPE modified in this way was thermally stressed five times at temperatures of 110 and 160 °C, and then the dynamic tensile behavior was determined. The deformation and surface temperature of the specimens were recorded by a high-speed infrared camera. Furthermore, two thermal methods of specimen evaluation were used: differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The result of the measurement is that the modification of HDPE by accelerated electrons had a positive effect on the dynamic tensile behavior of these materials

Details

Translated title of the contributionDynamisches Verhalten von spritzgegossenen und thermisch modifizierten Teilen aus Polyethylen hoher Dichte, die durch beschleunigte Elektronen modifiziert wurden
Original languageEnglish
Article number4970
Number of pages15
JournalPolymers 2022 / Advances in the Mechanical Behavior of Polymeric Materials)
Volume14:2022
Issue number22
DOIs
Publication statusPublished - 16 Nov 2022