Ductile film delamination from compliant substrates using hard overlayers
Research output: Contribution to journal › Article › Research › peer-review
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Ductile film delamination from compliant substrates using hard overlayers. / Cordill, Megan J; Marx, Vera Maria; Kirchlechner, Christoph.
In: Thin solid films, Vol. 571, 2014, p. 302-307.
In: Thin solid films, Vol. 571, 2014, p. 302-307.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Cordill, MJ, Marx, VM & Kirchlechner, C 2014, 'Ductile film delamination from compliant substrates using hard overlayers', Thin solid films, vol. 571, pp. 302-307. https://doi.org/10.1016/j.tsf.2014.02.093
APA
Vancouver
Cordill MJ, Marx VM, Kirchlechner C. Ductile film delamination from compliant substrates using hard overlayers. Thin solid films. 2014;571:302-307. doi: http://dx.doi.org/10.1016/j.tsf.2014.02.093
Author
Bibtex - Download
@article{4dc7f8b5f49e457f927f48e35c26e5b5,
title = "Ductile film delamination from compliant substrates using hard overlayers",
author = "Cordill, {Megan J} and Marx, {Vera Maria} and Christoph Kirchlechner",
year = "2014",
doi = "http://dx.doi.org/10.1016/j.tsf.2014.02.093",
language = "English",
volume = "571",
pages = "302--307",
journal = "Thin solid films",
issn = "0040-6090",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Ductile film delamination from compliant substrates using hard overlayers
AU - Cordill, Megan J
AU - Marx, Vera Maria
AU - Kirchlechner, Christoph
PY - 2014
Y1 - 2014
U2 - http://dx.doi.org/10.1016/j.tsf.2014.02.093
DO - http://dx.doi.org/10.1016/j.tsf.2014.02.093
M3 - Article
VL - 571
SP - 302
EP - 307
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
ER -
