Crack deflecting microstructure for improved electro-mechanical lifetimes of flexible systems
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- Erich Schmid Institute of Materials Science
Abstract
Polymer supported metal thin films for flexible and stretchable applications need to have exceptional electro-mechanical behavior. Typically, brittle metal films thicker than 300 nm will fail at low strains. It will be demonstrated that with residual stress and microstructural tuning, a 500 nm thick Mo film on polyimide has a high crack onset strain and does not fail electrically after 1000 tensile straining cycles of 1% due to a novel zig–zag microstructure. The zig–zag microstructure imparts a crack deflecting behavior which ensures longer lifetimes. As a consequence, a high crack onset strain does not indicate better behavior under cyclic loading conditions.
Details
Original language | English |
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Pages (from-to) | 47-49 |
Number of pages | 3 |
Journal | Materials letters |
Volume | 244.2019 |
Issue number | 1 June |
DOIs | |
Publication status | Published - 13 Feb 2019 |