Characterization of residual stresses by WEDM-assisted dissectioning

Research output: Contribution to journal › Conference article › peer-review

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Characterization of residual stresses by WEDM-assisted dissectioning. / Regener, B.; Krempaszky, C.; Werner, E. et al.
In: IOP Conference Series: Materials Science and Engineering, Vol. 10, No. 1, 012078, 01.01.2014.

Research output: Contribution to journal › Conference article › peer-review

Harvard

Regener, B, Krempaszky, C, Werner, E, Berhuber, E & Stockinger, M 2014, 'Characterization of residual stresses by WEDM-assisted dissectioning', IOP Conference Series: Materials Science and Engineering, vol. 10, no. 1, 012078. https://doi.org/10.1088/1757-899X/10/1/012078

APA

Regener, B., Krempaszky, C., Werner, E., Berhuber, E., & Stockinger, M. (2014). Characterization of residual stresses by WEDM-assisted dissectioning. IOP Conference Series: Materials Science and Engineering, 10(1), Article 012078. https://doi.org/10.1088/1757-899X/10/1/012078

Vancouver

Regener B, Krempaszky C, Werner E, Berhuber E, Stockinger M. Characterization of residual stresses by WEDM-assisted dissectioning. IOP Conference Series: Materials Science and Engineering. 2014 Jan 1;10(1):012078. doi: 10.1088/1757-899X/10/1/012078

Author

Regener, B. ; Krempaszky, C. ; Werner, E. et al. / Characterization of residual stresses by WEDM-assisted dissectioning. In: IOP Conference Series: Materials Science and Engineering. 2014 ; Vol. 10, No. 1.

Bibtex - Download

@article{24a572f2203048ecb7c0b72a5a4cdf89,
title = "Characterization of residual stresses by WEDM-assisted dissectioning",
keywords = "residual stresses, sequential sectioning, Ti-6Al-4V, die forging, heat treatment",
author = "B. Regener and C. Krempaszky and E. Werner and E. Berhuber and M. Stockinger",
year = "2014",
month = jan,
day = "1",
doi = "10.1088/1757-899X/10/1/012078",
language = "English",
volume = "10",
journal = "IOP Conference Series: Materials Science and Engineering",
issn = "1757-8981",
publisher = "IOP Publishing Ltd.",
number = "1",
note = "9th World Congress on Computational Mechanics, WCCM 2010, Held in Conjuction with the 4th Asian Pacific Congress on Computational Mechanics, APCOM 2010 ; Conference date: 19-07-2010 Through 23-07-2010",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Characterization of residual stresses by WEDM-assisted dissectioning

AU - Regener, B.

AU - Krempaszky, C.

AU - Werner, E.

AU - Berhuber, E.

AU - Stockinger, M.

PY - 2014/1/1

Y1 - 2014/1/1

KW - residual stresses

KW - sequential sectioning

KW - Ti-6Al-4V

KW - die forging

KW - heat treatment

UR - http://www.scopus.com/inward/record.url?scp=84907696884&partnerID=8YFLogxK

U2 - 10.1088/1757-899X/10/1/012078

DO - 10.1088/1757-899X/10/1/012078

M3 - Conference article

AN - SCOPUS:84907696884

VL - 10

JO - IOP Conference Series: Materials Science and Engineering

JF - IOP Conference Series: Materials Science and Engineering

SN - 1757-8981

IS - 1

M1 - 012078

T2 - 9th World Congress on Computational Mechanics, WCCM 2010, Held in Conjuction with the 4th Asian Pacific Congress on Computational Mechanics, APCOM 2010

Y2 - 19 July 2010 through 23 July 2010

ER -

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