Adhesives for “debonding-on-demand”: Triggered release mechanisms and typical applications
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In: International Journal of Adhesion and Adhesives, Vol. 99.2020, No. June, 102585, 05.03.2020.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Adhesives for “debonding-on-demand”
T2 - Triggered release mechanisms and typical applications
AU - Bandl, Christine
AU - Kern, Wolfgang
AU - Schlögl, Sandra
N1 - Publisher Copyright: © 2020
PY - 2020/3/5
Y1 - 2020/3/5
N2 - Pressure sensitive adhesives (PSAs) are utilized for temporary applications since bonding and debonding are determined by the adhesive-substrate interface and the mechanical and rheological properties of the PSA. Moreover, a wide variety of basic materials allows for proper adjustment of the adhesive properties (tack, peel adhesion, cohesion). Where the adjustment of the adhesive's chemical composition is not efficient enough to provide easy and clean removability in the end of the application, release functions can be incorporated into the adhesive system. The adhesive strength is reduced upon the action of external triggers such as UV-irradiation, heat, the use of electric currents or magnetic fields. Thereby, debonding may follow various mechanisms, including phase changes, chemical reactions, crosslinking and volumetric expansion. Furthermore, electrostatic attraction, polarization, shape memory effects and mechanical adhesion can be employed. This review summarizes the most important properties of PSAs and provides an overview of well-proven as well as new approaches for “debonding-on-demand” adhesive systems. In addition, the article describes proposed and already implemented applications of the presented adhesive systems in the microelectronic industry, the automotive sector and the healthcare field.
AB - Pressure sensitive adhesives (PSAs) are utilized for temporary applications since bonding and debonding are determined by the adhesive-substrate interface and the mechanical and rheological properties of the PSA. Moreover, a wide variety of basic materials allows for proper adjustment of the adhesive properties (tack, peel adhesion, cohesion). Where the adjustment of the adhesive's chemical composition is not efficient enough to provide easy and clean removability in the end of the application, release functions can be incorporated into the adhesive system. The adhesive strength is reduced upon the action of external triggers such as UV-irradiation, heat, the use of electric currents or magnetic fields. Thereby, debonding may follow various mechanisms, including phase changes, chemical reactions, crosslinking and volumetric expansion. Furthermore, electrostatic attraction, polarization, shape memory effects and mechanical adhesion can be employed. This review summarizes the most important properties of PSAs and provides an overview of well-proven as well as new approaches for “debonding-on-demand” adhesive systems. In addition, the article describes proposed and already implemented applications of the presented adhesive systems in the microelectronic industry, the automotive sector and the healthcare field.
KW - Adhesive
KW - External trigger
KW - Healthcare
KW - Microelectronics
KW - PSA tape
KW - Switchable adhesion
KW - “Debonding-on-demand”
UR - http://www.scopus.com/inward/record.url?scp=85082170198&partnerID=8YFLogxK
U2 - 10.1016/j.ijadhadh.2020.102585
DO - 10.1016/j.ijadhadh.2020.102585
M3 - Article
VL - 99.2020
JO - International Journal of Adhesion and Adhesives
JF - International Journal of Adhesion and Adhesives
SN - 0143-7496
IS - June
M1 - 102585
ER -