Ab initio study of oxygen vacancy filament formation at Ta/HfO2 interface
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In: Surfaces and Interfaces, Vol. 49.2024, No. June, 104418, 06.2024.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Ab initio study of oxygen vacancy filament formation at Ta/HfO2 interface
AU - Zhang, Donglan
AU - Wang, Jiong
AU - Wu, Qing
AU - Du, Yong
AU - Holec, David
N1 - Publisher Copyright: © 2024
PY - 2024/6
Y1 - 2024/6
N2 - The resistive switching (RS) behavior of resistive random access memory (RRAM) based on oxygen vacancy (V O) conduction is significantly affected by the interface properties between metal electrode and oxide layer, yet the modulation between the RS behavior and the physico-chemical properties of the interface is still not very clear. In this study, the correlative role of Ta/HfO 2 interface with the RS behavior in HfO 2-based RRAM is explored at atomic level. First-principles thermodynamic calculations show that the strong interaction between three-fold oxygen vacancies (V O3) leads to a formation of V O3-based conductive filament (CF) along direction perpendicular to the interface. Four-fold oxygen vacancies (V O4) make a major contribution to the re-formation and growth of CFs during the set process by diffusing into the residual filaments. The results of electronic properties further indicate that as the number of V Os perpendicular to the interface increases, the charge redistribution between O and Ta atoms at the interface is significantly increased, and more electron clouds are gathered around V Os. This is the underlying mechanism of forming a conductive channel. This study reveals the important regulation mechanism of the interface characteristics between metal electrode and oxide layer in RRAM on the formation and growth of V O-based CFs.
AB - The resistive switching (RS) behavior of resistive random access memory (RRAM) based on oxygen vacancy (V O) conduction is significantly affected by the interface properties between metal electrode and oxide layer, yet the modulation between the RS behavior and the physico-chemical properties of the interface is still not very clear. In this study, the correlative role of Ta/HfO 2 interface with the RS behavior in HfO 2-based RRAM is explored at atomic level. First-principles thermodynamic calculations show that the strong interaction between three-fold oxygen vacancies (V O3) leads to a formation of V O3-based conductive filament (CF) along direction perpendicular to the interface. Four-fold oxygen vacancies (V O4) make a major contribution to the re-formation and growth of CFs during the set process by diffusing into the residual filaments. The results of electronic properties further indicate that as the number of V Os perpendicular to the interface increases, the charge redistribution between O and Ta atoms at the interface is significantly increased, and more electron clouds are gathered around V Os. This is the underlying mechanism of forming a conductive channel. This study reveals the important regulation mechanism of the interface characteristics between metal electrode and oxide layer in RRAM on the formation and growth of V O-based CFs.
KW - Conductive filaments
KW - Interface
KW - Oxygen vacancy
KW - Resistive switching
KW - RRAM
UR - http://www.scopus.com/inward/record.url?scp=85191762298&partnerID=8YFLogxK
U2 - 10.1016/j.surfin.2024.104418
DO - 10.1016/j.surfin.2024.104418
M3 - Article
VL - 49.2024
JO - Surfaces and Interfaces
JF - Surfaces and Interfaces
SN - 2468-0230
IS - June
M1 - 104418
ER -