A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. / Thalhamer, A.; Fuchs, P.; Strohmeier, L. et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Thalhamer, A, Fuchs, P, Strohmeier, L, Hasil, S & Wolfberger, A 2022, A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, Institute of Electrical and Electronics Engineers, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian, Malta, 25/04/22. https://doi.org/10.1109/EuroSimE54907.2022.9758869

APA

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S., & Wolfberger, A. (2022). A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE54907.2022.9758869

Vancouver

Thalhamer A, Fuchs P, Strohmeier L, Hasil S, Wolfberger A. A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758869

Author

Thalhamer, A. ; Fuchs, P. ; Strohmeier, L. et al. / A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Bibtex - Download

@inproceedings{806e4a32f67b45bdbf386c0d6a348963,
title = "A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process",
author = "A. Thalhamer and P. Fuchs and L. Strohmeier and S. Hasil and A. Wolfberger",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 ; Conference date: 25-04-2022 Through 27-04-2022",
year = "2022",
doi = "10.1109/EuroSimE54907.2022.9758869",
language = "English",
series = "2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

AU - Thalhamer, A.

AU - Fuchs, P.

AU - Strohmeier, L.

AU - Hasil, S.

AU - Wolfberger, A.

N1 - Publisher Copyright: © 2022 IEEE.

PY - 2022

Y1 - 2022

UR - http://www.scopus.com/inward/record.url?scp=85129524836&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE54907.2022.9758869

DO - 10.1109/EuroSimE54907.2022.9758869

M3 - Conference contribution

AN - SCOPUS:85129524836

T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

PB - Institute of Electrical and Electronics Engineers

T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Y2 - 25 April 2022 through 27 April 2022

ER -

View graph of relations

SFX

Publication SFX