Raul Bermejo

Research output

  1. Published

    What is the tensile strength of a ceramic to be used in numerical models for predicting crack initiation?

    Leguillon, D., Martin, E., Sevecek, O. & Bermejo, R., 1 Jul 2018, In: International Journal of Fracture. 212, 1, p. 89-103 15 p.

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    Edge cracking due to a compressive residual stress in ceramic laminates

    Leguillon, D. P., Sevecek, O., Martin, E. & Bermejo, R., 2015, In: Comptes rendus mécanique .

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Application of the coupled stress-energy criterion to predict the fracture behavior of layered ceramics designed with internal compressive stresses.

    Leguillon, D. P., Martin, E., Sevecek, O. & Bermejo, R., 2015, In: European Journal of Mechanics - A/Solids. 54, p. 94-104 11 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Mechanical strength of cold-sintered zinc oxide under biaxial bending

    Lowum, S., Floyd, R., Bermejo, R. & Maria, J. P., 30 Mar 2019, In: Journal of materials science. 54, 6, p. 4518-4522 5 p.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published
  6. Published

    4th Year Progress Report & Final Report 2006-36a

    Lube, T., Pascual-Herrero, J. & Bermejo Moratinos, R., 2006

    Research output: Book/ReportCommissioned reportResearch

  7. Published

    Contact strength measurements on aluminia and shield 2006-18

    Lube, T., Bermejo Moratinos, R. & Pascual Herrero, J., 2006

    Research output: Book/ReportCommissioned reportResearch

  8. Published
  9. Published

    Mechanical properties of zirconia ceramics biomimetically coated with calcium deficient hydroxyapatite

    Macan, J., Dutour Sikiric, M., Deluca, M., Bermejo, R., Baudín, C., Plodinec, M., Salamon, K., Ceh, M. & Gajovic, A., Nov 2020, In: Journal of the Mechanical Behavior of Biomedical Materials. 111, 104006.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution