Michael Wurmshuber
(Former)
Activities
14th Multinational Congress on Microscopy MCM 2019
Zhao, M. (contributor), Issa, I. (contributor), Pfeifenberger, M. J. (contributor), Wurmshuber, M. (contributor) & Kiener, D. (Speaker)
17 Sept 2019Activity: Talk or presentation › Invited talk
2019 MRS Fall Meeting
Zhao, M. (Speaker), Issa, I. (contributor), Wurmshuber, M. (contributor), Pfeifenberger, M. J. (contributor) & Kiener, D. (contributor)
1 Dec 2019 → 6 Dec 2019Activity: Talk or presentation › Oral presentation
A biological nanocomposite with unusual property combinations
Kiener, D. (Speaker), Kim, J.-K. (contributor), Liu, Y. (contributor), Wurmshuber, M. (contributor), Peng, X.-L. (contributor), Seo, J. (contributor), Jeong, J. (contributor), Wang, Z. (contributor), Wilmers, J. (contributor), Soyarslan, C. (contributor), Kim, J. (contributor), Kittiwirayanon, B. (contributor), Jeong, J. (contributor), Kim, H.-J. (contributor), Huh, Y. H. (contributor), Bargmann, S. (contributor), Gao, H. (contributor) & Oh, S. H. (contributor)
2023Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Doppermann, S. (contributor), Burtscher, M. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor) & Kiener, D. (contributor)
17 Sept 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Alfreider, M. (contributor), Issa, I. (contributor), Schmuck, K. S. (contributor), Burtscher, M. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Gammer, C. (contributor), Maier-Kiener, V. (contributor) & Clemens, H. (contributor)
29 Nov 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Issa, I. (contributor) & Burtscher, M. (contributor)
3 Dec 2021Activity: Talk or presentation › Oral presentation
Complementary in-situ methods for crack evaluation within high-temperature materials at ambient conditions
Burtscher, M. (Speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Clemens, H. (contributor), Mayer, S. (contributor) & Kiener, D. (contributor)
17 Mar 2021Activity: Talk or presentation › Oral presentation
Effect of impurity doping on mechanical performance and microstructure in ufg Tungsten processed by HPT
Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Wurster, S. (contributor) & Kiener, D. (contributor)
30 Sept 2019Activity: Talk or presentation › Oral presentation
Employing Grain Boundary Segregation Engineering for Improved Mechanical Performance of Nanostructured Tungsten
Keckes, J. F. (Speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor), Hirle, A. (contributor), Riedl, H. (contributor) & Kiener, D. (contributor)
10 Oct 2024Activity: Talk or presentation › Oral presentation
Engineering Grain Boundary Cohesion for Improved Mechanical Properties in Doped Tungsten
Keckes, J. (Speaker), Kiener, D. (contributor), Alfreider, M. (contributor), Wurmshuber, M. (contributor) & Wurster, S. (contributor)
20 Sept 2023Activity: Talk or presentation › Oral presentation
