Michael Wurmshuber

(Former)

Activities

  1. 2021
  2. Fracture of distinct interfaces: In-situ observations vs. stiffness approaches

    Kiener, D. (Invited speaker), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Renk, O. (contributor), Issa, I. (contributor), Burtscher, M. (contributor) & Gammer, C. (contributor)

    3 Jun 2021

    Activity: Talk or presentation Oral presentation

  3. Micromechanical fracture characterization of an intermetallic light-weight TiAl alloy

    Burtscher, M. (Speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Clemens, H. (contributor), Mayer, S. (contributor) & Kiener, D. (contributor)

    15 Sept 2021

    Activity: Talk or presentation Oral presentation

  4. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Doppermann, S. (contributor), Burtscher, M. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor) & Kiener, D. (contributor)

    17 Sept 2021

    Activity: Talk or presentation Oral presentation

  5. How grain boundary doping affects the mechanical properties in ultra-fine grained tungsten and nanocrystalline tungsten composites

    Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Alfreider, M. (contributor), Schmuck, K. S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Maier-Kiener, V. (contributor), Clemens, H. (contributor) & Kiener, D. (contributor)

    29 Sept 2021

    Activity: Talk or presentation Oral presentation

  6. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Alfreider, M. (contributor), Issa, I. (contributor), Schmuck, K. S. (contributor), Burtscher, M. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Gammer, C. (contributor), Maier-Kiener, V. (contributor) & Clemens, H. (contributor)

    29 Nov 2021

    Activity: Talk or presentation Oral presentation

  7. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Issa, I. (contributor) & Burtscher, M. (contributor)

    3 Dec 2021

    Activity: Talk or presentation Oral presentation

  8. 2022
  9. Grain boundary doping as effective method to improve mechanical properties in ultra-fine grained tungsten

    Wurmshuber, M. (contributor), Doppermann, S. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Alfreider, M. (contributor), Schmuck, K. S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Maier-Kiener, V. (contributor), Clemens, H. (contributor) & Kiener, D. (Speaker)

    28 Feb 2022

    Activity: Talk or presentation Invited talk

  10. Strengthening and improving fracture toughness of tungsten-copper nanocomposites

    Schmuck, K. S. (Speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor) & Kiener, D. (contributor)

    14 Mar 2022

    Activity: Talk or presentation Oral presentation

  11. Studying Crack Tip Processes Using In-Situ Electron Microscopy

    Kiener, D. (Invited speaker), Alfreider, M. (contributor), Wurmshuber, M. (contributor), Schmuck, K. S. (contributor), Issa, I. (contributor), Burtscher, M. (contributor), Gammer, C. (contributor), Hohenwarter, A. (contributor) & Pippan, R. (contributor)

    10 May 2022

    Activity: Talk or presentation Invited talk

  12. Enhancing mechanical properties of ufg W via grain boundary segregation engineering

    Kiener, D. (Keynote speaker), Wurmshuber, M. (contributor), Doppermann, S. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Alfreider, M. (contributor), Schmuck, K. S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Clemens, H. (contributor) & Maier-Kiener, V. (contributor)

    30 May 2022

    Activity: Talk or presentation Invited talk