Daniel Kiener
Activities
- 2022
Acta Materialia (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Applied physics letters (Journal)
Kiener, D. (Editor)
2022Activity: Publication peer-review and editorial work › Editorial activity
Journal of materials science (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Materials & design (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Materials Research Letters [Elektronische Ressource] (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
MRS Bulletin (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
MRS Bulletin (Journal)
Kiener, D. (Editor)
2022Activity: Publication peer-review and editorial work › Editorial activity
Nature Materials (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Philosophical magazine (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Science Advances (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Scripta materialia (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
Small Methods (Journal)
Kiener, D. (Peer reviewer)
2022Activity: Publication peer-review and editorial work › Publication peer-review
- 2021
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Schmuck, K. S. (contributor), Issa, I. (contributor) & Burtscher, M. (contributor)
3 Dec 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Wurmshuber, M. (Speaker), Doppermann, S. (contributor), Alfreider, M. (contributor), Issa, I. (contributor), Schmuck, K. S. (contributor), Burtscher, M. (contributor), Wurster, S. (contributor), Jakob, S. (contributor), Bodlos, R. (contributor), Romaner, L. (contributor), Gammer, C. (contributor), Maier-Kiener, V. (contributor) & Clemens, H. (contributor)
29 Nov 2021Activity: Talk or presentation › Oral presentation
Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
Kiener, D. (Invited speaker), Massone, A. (Speaker), Manhart, A. (contributor), Jacob, W. (contributor), Drexler, A. (contributor) & Ecker, W. (contributor)
29 Nov 2021Activity: Talk or presentation › Oral presentation
Thomas Edwards
Kiener, D. (Host)
1 Nov 2021 → 31 Aug 2022Activity: Hosting a visitor › Hosting an academic visitor
