Barbara Putz
Research output
- Published
Electro-Mechanical testing of conductive materials used in flexible electronics
Cordill, M., Glushko, O. & Putz, B., 2016, In: Frontiers in Materials. 3, p. 1-11Research output: Contribution to journal › Article › Research › peer-review
- Published
Cyclic electo-mechanical behavior of ductile films strained with in-situ methods
Cordill, M., Glushko, O. & Putz, B., 2016.Research output: Contribution to conference › Presentation › Research
- Published
Electro-mechanical based failure criteria for flexible electronics
Cordill, M., Glushko, O. & Putz, B., 2016.Research output: Contribution to conference › Presentation › Research
- E-pub ahead of print
Microstructural influence on the cyclic electro-mechanical behaviour of ductile films on polymer substrates
Cordill, M., Glushko, O., Kleinbichler, A., Putz, B., Többens, D. & Kirchlechner, C., 17 Sept 2017, (E-pub ahead of print) In: Thin solid films. 644.2017, 31. December, p. 166-172 7 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Influence of interlayers on the interfacial behavior of Ag films on polymer substrates
Cordill, M., Paulitsch, M., Katsarelis, C., Putz, B., Lassnig, A. & Kennedy, M. S., 2022, In: Thin solid films. 742, 139051.Research output: Contribution to journal › Article › Research › peer-review
- Published
Film thickness and architecture effects in biaxially strained polymer supported Al/Mo bilayers
Cordill, M., Kreiml, P., Putz, B., Trost, C. O. W., Lassnig, A., Mitterer, C., Faurie, D. & Renault, P.-O., 2022, In: Materials Today Communications. 31.2022, June, 11 p., 103455.Research output: Contribution to journal › Article › Research › peer-review
- Published
Thermally Stable Nanotwins: New Heights for Cu Mechanics
Edwards, T. E. J., Rohbeck, N., Huzár, E., Keith, T., Putz, B., Polyakov, M. N., Maeder, X., Pethö, L. & Michler, J., 2022, In: Advanced science. 2203544.Research output: Contribution to journal › Article › Research › peer-review
- Published
Synthesis and mechanical properties of co-deposited W nanoparticle and ZrCuAg metallic glass thin film composites
Huszar, E., Sharma, A., Székely, L., Raghavan, R., Putz, B., Edwards, T. E. J., Spolenak, R., Michler, J. & Pethö, L., 31 May 2023, In: Thin solid films. 773, 139822.Research output: Contribution to journal › Article › Research › peer-review
- Published
Atomic diffusivities in amorphous and liquid Cu-Zr: Kirkendall effects and dependence on packing density
Ketov, S. V., Ivanov, Y. P., Putz, B., Zhang, Z., Eckert, J. & Greer, A. L., 1 Aug 2021, In: Acta Materialia. 214, 1 August, 8 p., 116993.Research output: Contribution to journal › Article › Research › peer-review
- Published
Enhancement of copper nanoparticle yield in magnetron sputter inert gas condensation by applying substrate bias voltage and its influence on thin film morphology
Knabl, F., Gutnik, D., Patil, P., Bandl, C., Vermeij, T., Pichler, C. M., Putz, B. & Mitterer, C., Dec 2024, In: Vacuum. 230, 113724.Research output: Contribution to journal › Article › Research › peer-review