Departments and Chairs

Organisational unit: Departments and Institutes

Research output

  1. Published
  2. Published
  3. Published

    A Design Support System for Plastic Injection Molds

    Fischer, K., Lucyshyn, T. & Langecker, G., 2006, Program and Abstracts of the 22nd Annual Meeting of the Polymer Processing Society, Yamagata, Japan 2006. p. 216-216

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  4. Published

    A device, charging unit and method of filling a borehole with an explosive material

    Finn, O. (Inventor), Moser, P. (Inventor), Finn, O. (Inventor), Moser, P. (Inventor) & Hohl, W. (Inventor), 11 Dec 2008, IPC No. F42D 3/ 04 A I, Patent No. AU2008258857, Priority date 4 Jun 2008, Priority No. WO2008EP04452

    Research output: Patent

  5. Published

    A DEVICE, CHARGING UNIT AND METHOD OF FILLING A BOREHOLE WITH AN EXPLOSIVE MATERIAL

    Hohl, W. (Inventor), Ouchterlony, F. (Inventor) & Moser, P. (Inventor), 23 Feb 2011, Patent No. ZA200908597, Priority date 4 Jun 2008, Priority No. WO2008EP04452

    Research output: Patent

  6. Published

    A DEVICE, CHARGING UNIT AND METHOD OF FILLING A BOREHOLE WITH AN EXPLOSIVE MATERIAL

    Moser, P. (Inventor), Ouchterlony, F. (Inventor) & Hohl, W. (Inventor), 11 Dec 2008, IPC No. F42D 3/ 04 A I, Patent No. CA2690037, Priority date 4 Jun 2008, Priority No. WO2008EP04452

    Research output: Patent

  7. Published

    A DEVICE, CHARGING UNIT AND METHOD OF FILLING A BOREHOLE WITH AN EXPLOSIVE MATERIAL

    Moser, P. (Inventor) & Ouchterlony, F. (Inventor), 11 Dec 2008, IPC No. F42D 3/ 04 A I, Patent No. WO2008148544, Priority date 4 Jun 2007, Priority No. EP20070010995

    Research output: Patent

  8. Published

    Adhesion Energies of Cr Thin Films on Polyimide Determined from Buckling: Experiment and Model

    Cordill, M., Fischer, F. D., Rammerstorfer, F. G. & Dehm, G., 2010, In: Acta materialia. 58, p. 5520-5531

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

    Lassnig, A., Putz, B., Hirn, S., Többens, D., Mitterer, C. & Cordill, M. J., 15 Feb 2021, In: Materials and Design. 200, 15 February, 8 p., 109451.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Adhesion measurements of printed circuit boards using four point bending

    Cordill, M., 2013.

    Research output: Contribution to conferencePosterResearchpeer-review