Department Polymer Engineering and Science

Organisational unit: Departments and Institutes

Research output

  1. 2023
  2. Published
  3. Published
  4. Published

    Sequentiaql orthogonality by [2+2] cycloadditions in dual-cure photopolymers

    Müller, S. M., Nelson, B., Naderer, C., Sivun, D., Jacak, J., Schlögl, S. & Griesser, T., 2023.

    Research output: Contribution to conferencePosterResearch

  5. Published

    STRESS- AND STRAIN-BASED FATIGUE LIFE CALCULATION FOR SHORT FIBER REINFORCED POLYMERS BY USE OF FE-SAFE®

    Kaylani, D., Primetzhofer, A., Stadler, G., Zacharias, T., Toenz, T. & Pinter, G., 2023.

    Research output: Contribution to conferencePaperpeer-review

  6. Published
  7. Published

    Sustainable bio-based UV-cured epoxy vitrimer from castor oil

    Bergoglio, M., Reisinger, D., Schlögl, S., Griesser, T. & Sangermano, M., 2023.

    Research output: Contribution to conferencePosterResearch

  8. Published

    Synthesis and Characterization of a Bio-Based Transesterification Catalyst for Green Photopolymers

    Sölle, B., Schlögl, S. & Rossegger, E., 2023.

    Research output: Contribution to conferencePosterResearch

  9. Published

    Synthesis and characterization of magnetic pholopolymers for nanoimprint lithography

    Schmidleitner, C., Schlögl, S., Trimmel, G. & Rossegger, E., 2023.

    Research output: Contribution to conferencePosterResearch

  10. Published

    Synthesis and characterization of magnetic photopolymers for nanoimprint lithography

    Schmidleitner, C., Schlögl, S., Trimmel, G. & Rossegger, E., 2023.

    Research output: Contribution to conferencePosterResearch

  11. Published

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution