Department Physics, Mechanics and Electrical Engineering

Organisational unit: Departments and Institutes

Research output

  1. 2021
  2. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperpeer-review

  3. Published
  4. Published

    A new development of four-point method to measure the electrical resistivity in situ during plastic deformation

    Saberi, S., Stockinger, M., Stoeckl, C., Buchmayr, B., Weiss, H., Afsharnia, R. & Hartl, K., 11 May 2021, In: Measurement. 180.2021, August, 109547.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Twisted graphene in graphite: Impact on surface potential andchemical stability

    Tran, T. H., Rodriguez, R. D., Salerno, M., Matković, A., Teichert, C. & Sheremet, E., May 2021, In: Carbon. 176.2021, May, p. 431-439 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. E-pub ahead of print

    Longitudinal and transverse low frequency viscoelastic characterization of wood pulp fibers at different relative humidity

    Czibula, C., Seidlhofer, T., Ganser, C., Hirn, U. & Teichert, C., 16 Apr 2021, (E-pub ahead of print) In: Materialia. 16.2021, May, 9 p., 101094.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Two-dimensional talc as a van der Waals material for solid lubrication at the nanoscale

    Vasić, B., Czibula, C. M., Kratzer, M., Ruegger Almeida Neves, B., Matkovic, A. & Teichert, C., 6 Apr 2021, In: Nanotechnology. 32.2021, 26, 11 p., 265701.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    PEDOT-supported Pd nanocatalysts - oxidation of formic acid

    Nakova, A., Ilieva, M., Czibula, C., Teichert, C. & Tsakova, V., 1 Apr 2021, In: Electrochimica acta. 374.2021, 1 April, 8 p., 137931.

    Research output: Contribution to journalArticleResearchpeer-review