Chair of Mechanics (400)
Organisational unit: Chair
651 - 660 out of 809Page size: 10
Research output
- Published
Simulation-Based Approaches for Optimized Tap-Hole Design
Unterreiter, G., Ishmurzin, A., Marschall, H. U. & Spanring, A., 2022, Furnace Tapping 2022.Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
- Published
Simulation der Lagerverluste in Großmotoren und deren Validierung
Antretter, T. (Reviewer), 2012, Graz : Eigenverlag.Research output: Other contribution › Transfer › peer-review
- Published
Simulation der thermischen Belastung blockgebremster Eisenbahnräder
Scheinast, D., 2021Research output: Thesis › Master's Thesis
- Published
Simulation des dynamischen/akustischen Verhaltens von Steuerkettentrieben
Grinschgl, M., 2019Research output: Thesis › Doctoral Thesis
- Published
Simulation des Freiformbiegens von Profilrohren im Automobilbau
Beulich, N. V., 2016Research output: Thesis › Master's Thesis
- Published
Simulation des thermomechanischen Verhaltens von Grobblechen während der Schnellkühlung
Eßl, W., Antretter, T. & Parteder, E., 2015.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Simulation des Wärmeübergangs beim Sprühen im Druckgießprozess
Hofer, P., Kaschnitz, E., Ecker, W. & Leindl, M., 2007, In: Gießerei-Rundschau. p. 166-168Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation of Chemically Driven Inelastic Strain in Multi-Component Systems with Non-Ideal Sources and Sinks for Vacancies
Svoboda, J., Fischer, F. D. & Gamsjäger, E., 2008, In: Acta materialia. 56, p. 351-357Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation of Phase Transformation and Material Plasticity for Press Hardening
Tomasch, M., Ecker, W. & Antretter, T., 2019, Proceedings of NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes. p. 362-365Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
