Chair of Materials Science and Testing of Polymers (210)
Organisational unit: Chair
Research output
- 2021
- Published
Crack Propagation Analysis of Compression Loaded Rolling Elements
Dlhý, P., Poduska, J., Berer, M., Gosch, A., Slavik, O., Nahlik, L. & Hutař, P., 19 May 2021, In: Materials. 14.2021, 10, 24 p., 2656.Research output: Contribution to journal › Article › Research › peer-review
- Published
Klemmvorrichtung und Verfahren zur Prüfung einer Zugfestigkeit eines Objektes
Julia, B., Bernd, S. & Franz, G., 15 May 2021, IPC No. G01N 3/ 04 A I, Patent No. AT523058, Priority date 10 Jan 2020, Priority No. AT20200050009Research output: Patent
- Published
Modelling Failure Of Polymers: An Optimization Strategy Based on Genetic Algorithms and Instrumented Impact Tests
Rueda, F., Rull, N., Quintana, C., Torres, J. P., Messiah, M., Frank, A., Arbeiter, F., Frontini, P. M. & Pinter, G., 30 Apr 2021, In: Journal of dynamic behavior of materials.Research output: Contribution to journal › Article › Research › peer-review
- Published
Theoretical and experimental investigations of mechanical vibrations of hot hammer forging
Saberi, S., Fischer, J., Stockinger, M., Tikal, R. & Afsharnia, R., 20 Apr 2021, In: International Journal of Advanced Manufacturing Technology. 114.2021, 9-10, p. 3037-3045 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Size-Induced Constraint Effects on Crack Initiation and Propagation Parameters in Ductile Polymers
Gosch, A., Arbeiter, F. J., Agnelli, S., Berer, M. & Baldi, F., 13 Apr 2021, In: Materials. 14.2021, 8, 23 p., 1945.Research output: Contribution to journal › Article › Research › peer-review
- Published
Quantification Approaches for Fatigue Crack Resistance of Thermoplastic Tape Layered Composites with Multiple Delaminations
Khudiakova, A., Brunner, A. J., Wolfahrt, M. & Pinter, G., 17 Mar 2021, In: Materials. 14.2021, 6, 23 p., 1476.Research output: Contribution to journal › Article › Research › peer-review
- Published
Correlation of the cyclic cracked round bar test and hydrostatic pressure test for unplasticized polyvinylchloride
Frank, A., Messiha, M., Koch, T., Poduška, J., Hutař, P., Arbeiter, F. & Pinter, G., 19 Feb 2021, In: Polymer Testing. 95.2021, March, 7 p., 107125.Research output: Contribution to journal › Article › Research › peer-review
- Published
Optimization of Mechanical Properties and Damage Tolerance in Polymer-Mineral Multilayer Composites
Wiener, J., Kaineder, H., Kolednik, O. & Arbeiter, F., 4 Feb 2021, In: Materials. 14.2021, 4, p. 1-19 19 p., 725.Research output: Contribution to journal › Article › Research › peer-review