Novel temperature dependent tensile test of freestanding copper thin film structures
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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in: Review of scientific instruments, Jahrgang Jun;(6), 2012, S. 064702/1-064702/9.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Novel temperature dependent tensile test of freestanding copper thin film structures
AU - Smolka, M.
AU - Motz, Christian
AU - Detzel, T.
AU - Robl, W.
AU - Grießer, Thomas
AU - Wimmer, Alexander Christoph
AU - Dehm, Gerhard
PY - 2012
Y1 - 2012
U2 - 10.1063/1.4725529
DO - 10.1063/1.4725529
M3 - Artikel
VL - Jun;(6)
SP - 064702/1-064702/9
JO - Review of scientific instruments
JF - Review of scientific instruments
SN - 0034-6748
ER -