Novel temperature dependent tensile test of freestanding copper thin film structures

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Standard

Novel temperature dependent tensile test of freestanding copper thin film structures. / Smolka, M.; Motz, Christian; Detzel, T. et al.
in: Review of scientific instruments, Jahrgang Jun;(6), 2012, S. 064702/1-064702/9.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Vancouver

Smolka M, Motz C, Detzel T, Robl W, Grießer T, Wimmer AC et al. Novel temperature dependent tensile test of freestanding copper thin film structures. Review of scientific instruments. 2012;Jun;(6):064702/1-064702/9. doi: 10.1063/1.4725529

Author

Smolka, M. ; Motz, Christian ; Detzel, T. et al. / Novel temperature dependent tensile test of freestanding copper thin film structures. in: Review of scientific instruments. 2012 ; Jahrgang Jun;(6). S. 064702/1-064702/9.

Bibtex - Download

@article{8bb18c3fff11431db157ca16b62ed013,
title = "Novel temperature dependent tensile test of freestanding copper thin film structures",
author = "M. Smolka and Christian Motz and T. Detzel and W. Robl and Thomas Grie{\ss}er and Wimmer, {Alexander Christoph} and Gerhard Dehm",
year = "2012",
doi = "10.1063/1.4725529",
language = "Deutsch",
volume = "Jun;(6)",
pages = "064702/1--064702/9",
journal = "Review of scientific instruments",
issn = "0034-6748",
publisher = "American Institute of Physics Publising LLC",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Novel temperature dependent tensile test of freestanding copper thin film structures

AU - Smolka, M.

AU - Motz, Christian

AU - Detzel, T.

AU - Robl, W.

AU - Grießer, Thomas

AU - Wimmer, Alexander Christoph

AU - Dehm, Gerhard

PY - 2012

Y1 - 2012

U2 - 10.1063/1.4725529

DO - 10.1063/1.4725529

M3 - Artikel

VL - Jun;(6)

SP - 064702/1-064702/9

JO - Review of scientific instruments

JF - Review of scientific instruments

SN - 0034-6748

ER -