New Insights into Nanoindentation-Based Adhesion Testing

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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New Insights into Nanoindentation-Based Adhesion Testing. / Kleinbichler, Andreas; Pfeifenberger, Manuel J.; Zechner, J. et al.
in: JOM, Jahrgang 69.2017, Nr. 11, 21.08.2017, S. 2237-2245.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Harvard

Kleinbichler, A, Pfeifenberger, MJ, Zechner, J, Moody, NR, Bahr, DF & Cordill, M 2017, 'New Insights into Nanoindentation-Based Adhesion Testing', JOM, Jg. 69.2017, Nr. 11, S. 2237-2245. https://doi.org/10.1007/s11837-017-2496-2

APA

Kleinbichler, A., Pfeifenberger, M. J., Zechner, J., Moody, N. R., Bahr, D. F., & Cordill, M. (2017). New Insights into Nanoindentation-Based Adhesion Testing. JOM, 69.2017(11), 2237-2245. https://doi.org/10.1007/s11837-017-2496-2

Vancouver

Kleinbichler A, Pfeifenberger MJ, Zechner J, Moody NR, Bahr DF, Cordill M. New Insights into Nanoindentation-Based Adhesion Testing. JOM. 2017 Aug 21;69.2017(11):2237-2245. doi: 10.1007/s11837-017-2496-2

Author

Kleinbichler, Andreas ; Pfeifenberger, Manuel J. ; Zechner, J. et al. / New Insights into Nanoindentation-Based Adhesion Testing. in: JOM. 2017 ; Jahrgang 69.2017, Nr. 11. S. 2237-2245.

Bibtex - Download

@article{470aa912093b4d98a09a7788dac3ede4,
title = "New Insights into Nanoindentation-Based Adhesion Testing",
abstract = "Nanoindentation, or instrumented indentation, is a versatile technique that is most often used to measure the elastic modulus and hardness of thin film systems. It can also be employed to measure thin film adhesion energies by producing well-defined areas of delamination. When combined with the proper mechanics-based model and characterization of the failing interfaces, nanoindentation-induced delamination is a powerful tool to quantify interfacial fracture. This article highlights new improvements to the technique that build off the work of Marshall and Evans in the 1980s. Indentation-induced delamination in systems with brittle films or substrates can be a balance between causing delamination and causing through-thickness or bulk fracture. Focused ion beam cross-sectioning and confocal laser scanning microscopy were used to characterize failing interfaces, additional fracture events were observed in the load–displacement curves, and the adhesion energy was determined using not only symmetric, ideally shaped buckles, but also irregular-shaped and half-delaminated buckles.",
author = "Andreas Kleinbichler and Pfeifenberger, {Manuel J.} and J. Zechner and N.R. Moody and Bahr, {D. F.} and Megan Cordill",
year = "2017",
month = aug,
day = "21",
doi = "10.1007/s11837-017-2496-2",
language = "English",
volume = "69.2017",
pages = "2237--2245",
journal = "JOM",
issn = "0148-6608",
publisher = "Minerals, Metals and Materials Society",
number = "11",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - New Insights into Nanoindentation-Based Adhesion Testing

AU - Kleinbichler, Andreas

AU - Pfeifenberger, Manuel J.

AU - Zechner, J.

AU - Moody, N.R.

AU - Bahr, D. F.

AU - Cordill, Megan

PY - 2017/8/21

Y1 - 2017/8/21

N2 - Nanoindentation, or instrumented indentation, is a versatile technique that is most often used to measure the elastic modulus and hardness of thin film systems. It can also be employed to measure thin film adhesion energies by producing well-defined areas of delamination. When combined with the proper mechanics-based model and characterization of the failing interfaces, nanoindentation-induced delamination is a powerful tool to quantify interfacial fracture. This article highlights new improvements to the technique that build off the work of Marshall and Evans in the 1980s. Indentation-induced delamination in systems with brittle films or substrates can be a balance between causing delamination and causing through-thickness or bulk fracture. Focused ion beam cross-sectioning and confocal laser scanning microscopy were used to characterize failing interfaces, additional fracture events were observed in the load–displacement curves, and the adhesion energy was determined using not only symmetric, ideally shaped buckles, but also irregular-shaped and half-delaminated buckles.

AB - Nanoindentation, or instrumented indentation, is a versatile technique that is most often used to measure the elastic modulus and hardness of thin film systems. It can also be employed to measure thin film adhesion energies by producing well-defined areas of delamination. When combined with the proper mechanics-based model and characterization of the failing interfaces, nanoindentation-induced delamination is a powerful tool to quantify interfacial fracture. This article highlights new improvements to the technique that build off the work of Marshall and Evans in the 1980s. Indentation-induced delamination in systems with brittle films or substrates can be a balance between causing delamination and causing through-thickness or bulk fracture. Focused ion beam cross-sectioning and confocal laser scanning microscopy were used to characterize failing interfaces, additional fracture events were observed in the load–displacement curves, and the adhesion energy was determined using not only symmetric, ideally shaped buckles, but also irregular-shaped and half-delaminated buckles.

U2 - 10.1007/s11837-017-2496-2

DO - 10.1007/s11837-017-2496-2

M3 - Article

VL - 69.2017

SP - 2237

EP - 2245

JO - JOM

JF - JOM

SN - 0148-6608

IS - 11

ER -