Multi-method characterization approach to facilitate a strategy to design mechanical and electrical properties of sintered copper
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in: Materials and Design, Jahrgang 2021, Nr. 197, 109188, 28.09.2020.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Multi-method characterization approach to facilitate a strategy to design mechanical and electrical properties of sintered copper
AU - Wijaya, A.
AU - Eichinger, B.
AU - Chamasemani, F. F.
AU - Sartory, B.
AU - Hammer, R.
AU - Maier-Kiener, V.
AU - Kiener, D.
AU - Mischitz, M.
AU - Brunner, R.
PY - 2020/9/28
Y1 - 2020/9/28
N2 - Advanced die application materials, utilizing pressure-less sintered copper, show great prospects regarding cost effectiveness, power density, withstanding high switching speeds and temperature loading for novel eco-friendly and high efficiency semiconductors. In general, to preserve high reliability in combination with electrical functionality the design of elastic as well as electrical material parameters is of great importance. Here, we present a multi-method characterization approach to understand the impact of the morphology on the elastic as well as electrical behavior, which facilitates a strategy to design the relevant material parameters by tuning the morphology. Nano-SEM/FIB tomography and SEM/EBSD are applied to probe the morphology of three representative copper films. Nanoindentation and 4-point probe are used to extract the elastic modulus and specific electrical resistivity, respectively. The evaluated material parameters are compared with modeling results using the analyzed image data as an input. For the crucial image analysis, we develop a validated objective image analysis workflow. We obtain a quantified insight about the effect of the heterogeneous morphologies on the elastic modulus and specific electrical resistivity, thereby delivering important information about the necessary homogeneous copper morphology- and nano-scale pore-design. The strategy shall provide design guidelines to ensure reliable and high-performance die attachments.
AB - Advanced die application materials, utilizing pressure-less sintered copper, show great prospects regarding cost effectiveness, power density, withstanding high switching speeds and temperature loading for novel eco-friendly and high efficiency semiconductors. In general, to preserve high reliability in combination with electrical functionality the design of elastic as well as electrical material parameters is of great importance. Here, we present a multi-method characterization approach to understand the impact of the morphology on the elastic as well as electrical behavior, which facilitates a strategy to design the relevant material parameters by tuning the morphology. Nano-SEM/FIB tomography and SEM/EBSD are applied to probe the morphology of three representative copper films. Nanoindentation and 4-point probe are used to extract the elastic modulus and specific electrical resistivity, respectively. The evaluated material parameters are compared with modeling results using the analyzed image data as an input. For the crucial image analysis, we develop a validated objective image analysis workflow. We obtain a quantified insight about the effect of the heterogeneous morphologies on the elastic modulus and specific electrical resistivity, thereby delivering important information about the necessary homogeneous copper morphology- and nano-scale pore-design. The strategy shall provide design guidelines to ensure reliable and high-performance die attachments.
KW - Computational image analysis
KW - Elastic modulus
KW - RVE finite element method
KW - Sintered materials
KW - Specific electrical resistivity
KW - Tomography
UR - http://www.scopus.com/inward/record.url?scp=85092427564&partnerID=8YFLogxK
U2 - 10.1016/j.matdes.2020.109188
DO - 10.1016/j.matdes.2020.109188
M3 - Article
AN - SCOPUS:85092427564
VL - 2021
JO - Materials and Design
JF - Materials and Design
SN - 0264-1275
IS - 197
M1 - 109188
ER -