Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Standard

Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure. / Ma, Pan; Wei, Z. J.; Jia, Yandong et al.
in: Journal of alloys and compounds, Jahrgang 709.2017, Nr. 30 June, 16.03.2017, S. 329-336.

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Harvard

Ma, P, Wei, ZJ, Jia, Y, Yu, ZS, Prashanth, KG, Yang, SL, Li, CG, Huang, LX & Eckert, J 2017, 'Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure', Journal of alloys and compounds, Jg. 709.2017, Nr. 30 June, S. 329-336. https://doi.org/10.1016/j.jallcom.2017.03.162

APA

Ma, P., Wei, Z. J., Jia, Y., Yu, Z. S., Prashanth, K. G., Yang, S. L., Li, C. G., Huang, L. X., & Eckert, J. (2017). Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure. Journal of alloys and compounds, 709.2017(30 June), 329-336. Vorzeitige Online-Publikation. https://doi.org/10.1016/j.jallcom.2017.03.162

Vancouver

Ma P, Wei ZJ, Jia Y, Yu ZS, Prashanth KG, Yang SL et al. Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure. Journal of alloys and compounds. 2017 Mär 16;709.2017(30 June):329-336. Epub 2017 Mär 16. doi: 10.1016/j.jallcom.2017.03.162

Author

Ma, Pan ; Wei, Z. J. ; Jia, Yandong et al. / Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure. in: Journal of alloys and compounds. 2017 ; Jahrgang 709.2017, Nr. 30 June. S. 329-336.

Bibtex - Download

@article{f1bf620ab090440fa177640b29d29eae,
title = "Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure",
abstract = "As an advanced electronic packaging material, SiCp/Al-20Si composites have been fabricated by high pressure solidification. The mechanism of formation of fibrous eutectic Si and the thermal conductivity (TC) behavior of the composites have been systematically investigated. High pressure decreases diffusion of Si phase significantly; moreover, SiC addition hinders the diffusion and provides nucleation sites for the Si phase. Both high pressure and SiC contribute to the formation of fibrous eutectic Si. The SiCp/Al-20Si composite solidified at 3 GPa exhibits lowest TC due to the formation of a supersaturated Al(Si) solid solution, whereas it is highest after ageing treatment. The optimal TC of the 45% SiCp/Al-20Si composite is 166.8 W/m·K at room temperature. The TC of the composites can be well predicted by the Hasselman-Johnson (H-J) theoretical model.",
author = "Pan Ma and Wei, {Z. J.} and Yandong Jia and Yu, {Z. S.} and Prashanth, {Konda Gokuldoss} and Yang, {S. L.} and Li, {C. G.} and Huang, {L. X.} and J{\"u}rgen Eckert",
year = "2017",
month = mar,
day = "16",
doi = "10.1016/j.jallcom.2017.03.162",
language = "English",
volume = "709.2017",
pages = "329--336",
journal = "Journal of alloys and compounds",
issn = "0925-8388",
publisher = "Elsevier",
number = "30 June",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Mechanism of formation of fibrous eutectic Si and thermal conductivity of SiCp/Al-20Si composites solidified under high pressure

AU - Ma, Pan

AU - Wei, Z. J.

AU - Jia, Yandong

AU - Yu, Z. S.

AU - Prashanth, Konda Gokuldoss

AU - Yang, S. L.

AU - Li, C. G.

AU - Huang, L. X.

AU - Eckert, Jürgen

PY - 2017/3/16

Y1 - 2017/3/16

N2 - As an advanced electronic packaging material, SiCp/Al-20Si composites have been fabricated by high pressure solidification. The mechanism of formation of fibrous eutectic Si and the thermal conductivity (TC) behavior of the composites have been systematically investigated. High pressure decreases diffusion of Si phase significantly; moreover, SiC addition hinders the diffusion and provides nucleation sites for the Si phase. Both high pressure and SiC contribute to the formation of fibrous eutectic Si. The SiCp/Al-20Si composite solidified at 3 GPa exhibits lowest TC due to the formation of a supersaturated Al(Si) solid solution, whereas it is highest after ageing treatment. The optimal TC of the 45% SiCp/Al-20Si composite is 166.8 W/m·K at room temperature. The TC of the composites can be well predicted by the Hasselman-Johnson (H-J) theoretical model.

AB - As an advanced electronic packaging material, SiCp/Al-20Si composites have been fabricated by high pressure solidification. The mechanism of formation of fibrous eutectic Si and the thermal conductivity (TC) behavior of the composites have been systematically investigated. High pressure decreases diffusion of Si phase significantly; moreover, SiC addition hinders the diffusion and provides nucleation sites for the Si phase. Both high pressure and SiC contribute to the formation of fibrous eutectic Si. The SiCp/Al-20Si composite solidified at 3 GPa exhibits lowest TC due to the formation of a supersaturated Al(Si) solid solution, whereas it is highest after ageing treatment. The optimal TC of the 45% SiCp/Al-20Si composite is 166.8 W/m·K at room temperature. The TC of the composites can be well predicted by the Hasselman-Johnson (H-J) theoretical model.

U2 - 10.1016/j.jallcom.2017.03.162

DO - 10.1016/j.jallcom.2017.03.162

M3 - Article

VL - 709.2017

SP - 329

EP - 336

JO - Journal of alloys and compounds

JF - Journal of alloys and compounds

SN - 0925-8388

IS - 30 June

ER -

Beziehungsdiagramm anzeigen

360 Link

Zeitschriften in BUGL