Knowledge Incorporation for Machine Learning in Condition Monitoring: A Survey
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Proceedings - 2021 International Symposium on Electrical, Electronics and Information Engineering, ISEEIE 2021. Association for Computing Machinery (ACM), 2021. S. 230-240 (ACM International Conference Proceeding Series).
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
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TY - GEN
T1 - Knowledge Incorporation for Machine Learning in Condition Monitoring
T2 - 2021 International Symposium on Electrical, Electronics and Information Engineering, ISEEIE 2021
AU - Hagendorfer, Elias Jan
N1 - Publisher Copyright: © 2021 ACM.
PY - 2021/2/19
Y1 - 2021/2/19
UR - http://www.scopus.com/inward/record.url?scp=85113229418&partnerID=8YFLogxK
U2 - 10.1145/3459104.3459144
DO - 10.1145/3459104.3459144
M3 - Conference contribution
AN - SCOPUS:85113229418
T3 - ACM International Conference Proceeding Series
SP - 230
EP - 240
BT - Proceedings - 2021 International Symposium on Electrical, Electronics and Information Engineering, ISEEIE 2021
PB - Association for Computing Machinery (ACM)
Y2 - 19 February 2021 through 21 February 2021
ER -