Implementation of a viscoplastic substrate creep model in the thermomechanical simulation of the WAAM process
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in: Welding in the world, 2022.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Implementation of a viscoplastic substrate creep model in the thermomechanical simulation of the WAAM process
AU - Springer, Sebastian
AU - Röcklinger, Aandreas
AU - Leitner, Martin
AU - Grün, Florian
AU - Gruber, T.
AU - Lasnik, M.
AU - Oberwinkler, Bernd
N1 - Publisher Copyright: © 2021, The Author(s).
PY - 2022
Y1 - 2022
KW - Additive manufacturing
KW - Thermomechanical simulation
KW - Ti-6Al-4 V
KW - Viscoplastic model
KW - WAAM
KW - Ti-6Al-4 V
UR - http://www.scopus.com/inward/record.url?scp=85120847573&partnerID=8YFLogxK
U2 - 10.1007/s40194-021-01232-x
DO - 10.1007/s40194-021-01232-x
M3 - Article
AN - SCOPUS:85120847573
JO - Welding in the world
JF - Welding in the world
SN - 0043-2288
ER -