For atom probe tomography (APT) and transmission electron microscopy (TEM) half grids are commonly applied as specimen carriers, serving as mount for focused ion beam (FIB) processed lift-outs. This technical note presents an alternative way to fabricate half grids directly from the material to be investigated using femtosecond (fs)-laser ablation. After cutting ∼200 µm thin in-plane and cross-plane slices from a TiN coated cemented carbide substrate using a precision cutting saw, two different half grid geometries, one suitable for APT and the other for TEM, were cut via fs-laser processing. Freestanding posts for APT were further sharpened and the areas intended for TEM were thinned top-down using the fs-laser system followed by final annular FIB milling of the APT and thinning of the TEM specimens. For proof of concept, the TiN APT half grid specimens in in- and cross-plane direction were successfully measured in voltage and laser-assisted mode, utilizing a local electrode atom probe, while electron transparency of the in- and cross-plane TEM half grid specimens was proven using a scanning electron microscope equipped with a scanning transmission electron microscopy (STEM) detector. The herein presented method is simple, fast and omits the necessity of a lift-out, reducing the complexity of FIB operations. Additionally, a frequently considered weak point of APT lift-out specimens, the Pt weld between specimen and half grid or microtip coupon is avoided, whilst a wide range of materials can be processed and consumables consumption is reduced. Thus, this work clearly demonstrates the great potential of fs-laser processing for APT and TEM specimen preparation.