Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces. / Oh, S.H.; Scheu, Christina; Wagner, T. et al.
in: Acta materialia, Jahrgang 54, 2006, S. 2685-2696.
in: Acta materialia, Jahrgang 54, 2006, S. 2685-2696.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
Harvard
Oh, SH, Scheu, C, Wagner, T, Tchernychova, E & Rühle, M 2006, 'Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces', Acta materialia, Jg. 54, S. 2685-2696. https://doi.org/10.1016/j.actamat.2006.02.011
APA
Oh, S. H., Scheu, C., Wagner, T., Tchernychova, E., & Rühle, M. (2006). Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces. Acta materialia, 54, 2685-2696. https://doi.org/10.1016/j.actamat.2006.02.011
Vancouver
Oh SH, Scheu C, Wagner T, Tchernychova E, Rühle M. Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces. Acta materialia. 2006;54:2685-2696. doi: 10.1016/j.actamat.2006.02.011
Author
Bibtex - Download
@article{4b4983cb39254881bf1bad1084c874a6,
title = "Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces",
author = "S.H. Oh and Christina Scheu and T. Wagner and Elena Tchernychova and M. R{\"u}hle",
year = "2006",
doi = "10.1016/j.actamat.2006.02.011",
language = "English",
volume = "54",
pages = "2685--2696",
journal = "Acta materialia",
issn = "1359-6454",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Epitaxy and Bonding of Cu Films on Oxygen-Terminated a-Al2O3 (0001) Surfaces
AU - Oh, S.H.
AU - Scheu, Christina
AU - Wagner, T.
AU - Tchernychova, Elena
AU - Rühle, M.
PY - 2006
Y1 - 2006
U2 - 10.1016/j.actamat.2006.02.011
DO - 10.1016/j.actamat.2006.02.011
M3 - Article
VL - 54
SP - 2685
EP - 2696
JO - Acta materialia
JF - Acta materialia
SN - 1359-6454
ER -
