Creep Behavior of a β-solidifying TiAl Alloy with Fully Lamellar Microstructure

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Creep Behavior of a β-solidifying TiAl Alloy with Fully Lamellar Microstructure. / Burtscher, Michael; Klein, Thomas; Mayer, Svea et al.
2016. 2016 MRS Fall Meeting & Exhibit, Boston, USA / Vereinigte Staaten.

Publikationen: KonferenzbeitragVortragForschung

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Burtscher, M, Klein, T, Mayer, S & Clemens, H 2016, 'Creep Behavior of a β-solidifying TiAl Alloy with Fully Lamellar Microstructure', 2016 MRS Fall Meeting & Exhibit, Boston, USA / Vereinigte Staaten, 27/11/16 - 2/12/16.

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Bibtex - Download

@conference{bf0826d12d8b447a9069d3bde01b31a2,
title = "Creep Behavior of a β-solidifying TiAl Alloy with Fully Lamellar Microstructure",
author = "Michael Burtscher and Thomas Klein and Svea Mayer and Helmut Clemens",
year = "2016",
month = nov,
day = "28",
language = "English",
note = "2016 MRS Fall Meeting & Exhibit ; Conference date: 27-11-2016 Through 02-12-2016",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - Creep Behavior of a β-solidifying TiAl Alloy with Fully Lamellar Microstructure

AU - Burtscher, Michael

AU - Klein, Thomas

AU - Mayer, Svea

AU - Clemens, Helmut

PY - 2016/11/28

Y1 - 2016/11/28

M3 - Presentation

T2 - 2016 MRS Fall Meeting & Exhibit

Y2 - 27 November 2016 through 2 December 2016

ER -