Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending
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in: Thin solid films, Jahrgang 687.2019, Nr. 1 October, 137480, 01.10.2019.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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TY - JOUR
T1 - Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending
AU - Kreiml, Patrice
AU - Rausch, Martin
AU - Terziyska, Velislava L.
AU - Köstenbauer, Harald
AU - Winkler, Jörg
AU - Mitterer, Christian
AU - Cordill, Megan J.
PY - 2019/10/1
Y1 - 2019/10/1
KW - Aluminum
KW - Bending
KW - Electrical properties
KW - Fracture
KW - Molybdenum
KW - Sputtering
KW - Thin films
UR - http://www.scopus.com/inward/record.url?scp=85070419155&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2019.137480
DO - 10.1016/j.tsf.2019.137480
M3 - Article
AN - SCOPUS:85070419155
VL - 687.2019
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
IS - 1 October
M1 - 137480
ER -