Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending

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Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending. / Kreiml, Patrice; Rausch, Martin; Terziyska, Velislava L. et al.
in: Thin solid films, Jahrgang 687.2019, Nr. 1 October, 137480, 01.10.2019.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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@article{1f52dfb572a54cc7976de142021f254d,
title = "Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending",
keywords = "Aluminum, Bending, Electrical properties, Fracture, Molybdenum, Sputtering, Thin films",
author = "Patrice Kreiml and Martin Rausch and Terziyska, {Velislava L.} and Harald K{\"o}stenbauer and J{\"o}rg Winkler and Christian Mitterer and Cordill, {Megan J.}",
year = "2019",
month = oct,
day = "1",
doi = "10.1016/j.tsf.2019.137480",
language = "English",
volume = "687.2019",
journal = "Thin solid films",
issn = "0040-6090",
publisher = "Elsevier",
number = "1 October",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending

AU - Kreiml, Patrice

AU - Rausch, Martin

AU - Terziyska, Velislava L.

AU - Köstenbauer, Harald

AU - Winkler, Jörg

AU - Mitterer, Christian

AU - Cordill, Megan J.

PY - 2019/10/1

Y1 - 2019/10/1

KW - Aluminum

KW - Bending

KW - Electrical properties

KW - Fracture

KW - Molybdenum

KW - Sputtering

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=85070419155&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2019.137480

DO - 10.1016/j.tsf.2019.137480

M3 - Article

AN - SCOPUS:85070419155

VL - 687.2019

JO - Thin solid films

JF - Thin solid films

SN - 0040-6090

IS - 1 October

M1 - 137480

ER -