About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Standard
About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation. / Ludwig, Andreas; Wu, Menghuai; Wang, T et al.
Computational Modeling and Simulation of Materials, III, Part B.. 2004. S. 491-502.
Computational Modeling and Simulation of Materials, III, Part B.. 2004. S. 491-502.
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
Ludwig, A, Wu, M, Wang, T & Bührig-Polaczek, A 2004, About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation. in Computational Modeling and Simulation of Materials, III, Part B.. S. 491-502.
APA
Ludwig, A., Wu, M., Wang, T., & Bührig-Polaczek, A. (2004). About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation. In Computational Modeling and Simulation of Materials, III, Part B. (S. 491-502)
Vancouver
Ludwig A, Wu M, Wang T, Bührig-Polaczek A. About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation. in Computational Modeling and Simulation of Materials, III, Part B.. 2004. S. 491-502
Author
Bibtex - Download
@inproceedings{8bd7be62549f415ba8b6bbbc24ecf6d2,
title = "About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation",
author = "Andreas Ludwig and Menghuai Wu and T Wang and A B{\"u}hrig-Polaczek",
year = "2004",
language = "English",
pages = "491--502",
booktitle = "Computational Modeling and Simulation of Materials, III, Part B.",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - About the interactions between thermo-solutal convection, shrinkage flow and grain sedimentation
AU - Ludwig, Andreas
AU - Wu, Menghuai
AU - Wang, T
AU - Bührig-Polaczek, A
PY - 2004
Y1 - 2004
M3 - Conference contribution
SP - 491
EP - 502
BT - Computational Modeling and Simulation of Materials, III, Part B.
ER -