A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., Oct 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A Rayleigh-Ritz Autoencoder

Terbuch, A., O'Leary, P., Ninevski, D., Hagendorfer, E. J., Schlager, E., Windisch, A. & Schweimer, C., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers, p. 1-6

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Automatic Synthesis of Admissible Functions for Variational Learning

O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Identifying the potential of SiC technology for PV inverters

Eskilson, T., Jehle, A., Schmidt, P., Makoschitz, M. & Baumgartner, F., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Improved nanoindentation methods for polymer based multilayer film cross-sections

Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model

Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Instrumented Milling Process and Analysis for Tool Wear Measurement

Ninevski, D., Yifrach, Y. & O'Leary, P., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Measurement of WBG-based power supplies

Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

The Influence of Isolation on Learning in an Immersive Laboratory Environment

Holly, M., Sommer, S., Ruh, T., Stadlbauer, D., Rameshan, C. & Pirker, J., 2023, International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N.-S., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (eds.). Institute of Electrical and Electronics Engineers, Vol. 2023. p. 285-289 5 p. (2023 IEEE International Conference on Advanced Learning Technologies (ICALT)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings

Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; vol. 2022-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Characterization and modeling of a typical curing material for photoresist films

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Dynamic Mechanical Response in Epoxy Nanocomposites Incorporating Various Nano-Silica Architectures

Chaudhary, S., Vryonis, O., Vaughan, A. S., Andritsch, T. & Feuchter, M., 2022, ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings. Institute of Electrical and Electronics Engineers, p. 86-89 4 p. (ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hybrid Machine Learning for Anomaly Detection in Industrial Time-Series Measurement Data

Terbuch, A., O'Leary, P. & Auer, P., 2022, I2MTC 2022 - IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement under Pandemic Constraints, Proceedings. Institute of Electrical and Electronics Engineers, (Conference Record - IEEE Instrumentation and Measurement Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods

Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, p. 317-322 6 p. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., 20 Dec 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A probabilistic approach for complete coverage path planning with low-cost systems

Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research

Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Jul 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, p. 1148 1 p. (2021 IEEE World Haptics Conference, WHC 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Effects of artificial ageing tests on EVA degradation: Influence of microclimate and methodology approach

Barretta, C., Oreski, G., Kyranaki, N., Mansour, D. E., Betts, T. R., Bauermann, L. P. & Resch-Fauster, K., 20 Jun 2021, 2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021. Institute of Electrical and Electronics Engineers, p. 312-315 4 p. (Conference Record of the IEEE Photovoltaic Specialists Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Development and Hardware-in-the-Loop Simulation of an Air Purifier Automatic Control System

Babunski, D., Zaev, E., Poposki, F., Koleva, R. & Rath, G., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Institute of Electrical and Electronics Engineers, 9460141. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hardware-in-the-loop for Simulation and Control of Greenhouse Climate

Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Estimating Parameters of a Sine Wave by the Method of Variable Projection

O'Leary, P. & Ninevski, D., 17 May 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; vol. 2021-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles

Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 17 May 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers, 9459889. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; vol. 2021-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Learning to Drive with Deep Reinforcement Learning

Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, p. 147-152 6 p. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A Flexible CAEX Based Model for Standard Integration in Tunnelling

Paskaleva, G., Mazak-Huemer, A., Waldhart, J. & Ehrbar, H., 2021, 2021 ETFA – IEEE 26th International Conference on Emerging Technologies and Factory Automation. Institute of Electrical and Electronics Engineers, p. 1-8 8 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Grid Load Mitigation in EV Fast Charging Stations Through Integration of a High-Performance Flywheel Energy Storage System with CFRP Rotor

Buchroithner, A., Presmair, R., Haidl, P., Wegleiter, H., Thormann, B., Kienberger, T., Auer, P. & Domitner, J., 2021, 2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021. Institute of Electrical and Electronics Engineers, (2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

PermeabilityNets: Comparing Neural Network Architectures on a Sequence-to-Instance Task in CFRP Manufacturing

Stieber, S., Schroter, N., Fauster, E., Schiendorfer, A. & Reif, W., 2021, Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021. Wani, M. A., Sethi, I. K., Shi, W., Qu, G., Raicu, D. S. & Jin, R. (eds.). Institute of Electrical and Electronics Engineers, p. 694-697 4 p. (Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A novel method for solving an optimal control problem for a numerically stiff independent metering system

Stojanoski, G., Ninevski, D., Rath, G. & Harker, M., 26 Nov 2020, 2020 Australian and New Zealand Control Conference, ANZCC 2020. Institute of Electrical and Electronics Engineers, p. 108-113 6 p. 9318391. (2020 Australian and New Zealand Control Conference, ANZCC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Unified Software Interface for Numerical Evaluation of Integrals and Derivatives of Fractional Order

Skovranek, T., Harker, M., Podlubny, I., O'Leary, P. & Petras, I., 27 Oct 2020, Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020. Petras, I. & Kacur, J. (eds.). Institute of Electrical and Electronics Engineers, 9257225. (Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

Rath, G., Zaev, E. & Babunski, D., 1 Jun 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (eds.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials

Ritt, R., Harker, M. & O'Leary, P., 1 May 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, p. 282-289 8 p. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Numerical Investigation of Collective Motion of Cathode Spots

Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Vol. 2. p. 467-469 3 p. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Force and acoustic emission measurements for condition monitoring of fine blanking tools

Kollment, W., O'Leary, P., Harker, M., Klunsner, T. & Eck, S., 10 Jul 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Real-time tensor polynomial approximation of crosshatch measured geometric surface data

Harker, M., O'Leary, P., Plessing, L., Hergan, P. & Fauster, E., 10 Jul 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Global least squares for time-domain system identification of state-space models

Harker, M. & Rath, G., 6 Jul 2018, 2018 7th Mediterranean Conference on Embedded Computing, MECO 2018 - Including ECYPS 2018, Proceedings. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution