A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., Oct 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A Rayleigh-Ritz Autoencoder

Terbuch, A., O'Leary, P., Ninevski, D., Hagendorfer, E. J., Schlager, E., Windisch, A. & Schweimer, C., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers, p. 1-6

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Automatic Synthesis of Admissible Functions for Variational Learning

O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Identifying the potential of SiC technology for PV inverters

Eskilson, T., Jehle, A., Schmidt, P., Makoschitz, M. & Baumgartner, F., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Improved nanoindentation methods for polymer based multilayer film cross-sections

Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model

Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Instrumented Milling Process and Analysis for Tool Wear Measurement

Ninevski, D., Yifrach, Y. & O'Leary, P., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Measurement of WBG-based power supplies

Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

The Influence of Isolation on Learning in an Immersive Laboratory Environment

Holly, M., Sommer, S., Ruh, T., Stadlbauer, D., Rameshan, C. & Pirker, J., 2023, International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N.-S., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (eds.). Institute of Electrical and Electronics Engineers, Vol. 2023. p. 285-289 5 p. (2023 IEEE International Conference on Advanced Learning Technologies (ICALT)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings

Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; vol. 2022-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Characterization and modeling of a typical curing material for photoresist films

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Dynamic Mechanical Response in Epoxy Nanocomposites Incorporating Various Nano-Silica Architectures

Chaudhary, S., Vryonis, O., Vaughan, A. S., Andritsch, T. & Feuchter, M., 2022, ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings. Institute of Electrical and Electronics Engineers, p. 86-89 4 p. (ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hybrid Machine Learning for Anomaly Detection in Industrial Time-Series Measurement Data

Terbuch, A., O'Leary, P. & Auer, P., 2022, I2MTC 2022 - IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement under Pandemic Constraints, Proceedings. Institute of Electrical and Electronics Engineers, (Conference Record - IEEE Instrumentation and Measurement Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods

Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, p. 317-322 6 p. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., 20 Dec 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics Engineers

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution