Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

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Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates. / Yalagach, Mahesh; Fuchs, Peter; Antretter, Thomas et al.
In: Sensors & transducers, Vol. 248.2021, No. 1, 29.01.2021.

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@article{eb7003a7d43e4581baae71dea8bf64da,
title = "Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates",
abstract = "The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multimaterial composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material sensitivity to environmental influences will ensure the sensors' reliable performance during their application lifetime. To this end, the potentially applied materials undergo defined thermal and moisture-dependent material characterization. In this contribution, the influence of moisture and temperature has been studied for five different prepreg materials, which are commonly applied as a substrate material in a MEM'S sensor. The measured thermal and moisture dependent material properties are the basis for a numerical diffusion analysis and a virtual hygro-thermomechanical reliability assessment.",
author = "Mahesh Yalagach and Peter Fuchs and Thomas Antretter and Michael Feuchter and Qi Tao and Markus Weber",
year = "2021",
month = jan,
day = "29",
language = "Deutsch",
volume = "248.2021",
journal = "Sensors & transducers",
issn = "1726-5489",
number = "1",

}

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TY - JOUR

T1 - Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

AU - Yalagach, Mahesh

AU - Fuchs, Peter

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Tao, Qi

AU - Weber, Markus

PY - 2021/1/29

Y1 - 2021/1/29

N2 - The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multimaterial composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material sensitivity to environmental influences will ensure the sensors' reliable performance during their application lifetime. To this end, the potentially applied materials undergo defined thermal and moisture-dependent material characterization. In this contribution, the influence of moisture and temperature has been studied for five different prepreg materials, which are commonly applied as a substrate material in a MEM'S sensor. The measured thermal and moisture dependent material properties are the basis for a numerical diffusion analysis and a virtual hygro-thermomechanical reliability assessment.

AB - The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multimaterial composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material sensitivity to environmental influences will ensure the sensors' reliable performance during their application lifetime. To this end, the potentially applied materials undergo defined thermal and moisture-dependent material characterization. In this contribution, the influence of moisture and temperature has been studied for five different prepreg materials, which are commonly applied as a substrate material in a MEM'S sensor. The measured thermal and moisture dependent material properties are the basis for a numerical diffusion analysis and a virtual hygro-thermomechanical reliability assessment.

M3 - Artikel

VL - 248.2021

JO - Sensors & transducers

JF - Sensors & transducers

SN - 1726-5489

IS - 1

ER -