The micromechanical characterization of silicon up to 950
Research output: Contribution to conference › Poster › Research
Standard
The micromechanical characterization of silicon up to 950. / Schaffar, Gerald Josef Kamillo; Tscharnuter, Daniel; Imrich, Peter Julian et al.
2022. Poster session presented at Infineon meets University 2022, München, Germany.
2022. Poster session presented at Infineon meets University 2022, München, Germany.
Research output: Contribution to conference › Poster › Research
Harvard
Schaffar, GJK, Tscharnuter, D, Imrich, PJ & Maier-Kiener, V 2022, 'The micromechanical characterization of silicon up to 950', Infineon meets University 2022, München, Germany, 24/11/22 - 24/11/22.
APA
Schaffar, G. J. K., Tscharnuter, D., Imrich, P. J., & Maier-Kiener, V. (2022). The micromechanical characterization of silicon up to 950. Poster session presented at Infineon meets University 2022, München, Germany.
Vancouver
Schaffar GJK, Tscharnuter D, Imrich PJ, Maier-Kiener V. The micromechanical characterization of silicon up to 950. 2022. Poster session presented at Infineon meets University 2022, München, Germany.
Author
Bibtex - Download
@conference{e476c095ded54027a84e701994069bf1,
title = "The micromechanical characterization of silicon up to 950",
author = "Schaffar, {Gerald Josef Kamillo} and Daniel Tscharnuter and Imrich, {Peter Julian} and Verena Maier-Kiener",
year = "2022",
language = "English",
note = "Infineon meets University 2022 ; Conference date: 24-11-2022 Through 24-11-2022",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - The micromechanical characterization of silicon up to 950
AU - Schaffar, Gerald Josef Kamillo
AU - Tscharnuter, Daniel
AU - Imrich, Peter Julian
AU - Maier-Kiener, Verena
PY - 2022
Y1 - 2022
M3 - Poster
T2 - Infineon meets University 2022
Y2 - 24 November 2022 through 24 November 2022
ER -
