Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films
Research output: Contribution to journal › Article › Research › peer-review
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Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films. / Turnow, H.; Wendrock, H.; Menzel, S. et al.
In: Thin solid films, Vol. 598, 01.01.2016, p. 184-188.
In: Thin solid films, Vol. 598, 01.01.2016, p. 184-188.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Turnow, H, Wendrock, H, Menzel, S, Gemming, T & Eckert, J 2016, 'Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films', Thin solid films, vol. 598, pp. 184-188. https://doi.org/10.1016/j.tsf.2015.10.081
APA
Turnow, H., Wendrock, H., Menzel, S., Gemming, T., & Eckert, J. (2016). Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films. Thin solid films, 598, 184-188. https://doi.org/10.1016/j.tsf.2015.10.081
Vancouver
Turnow H, Wendrock H, Menzel S, Gemming T, Eckert J. Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films. Thin solid films. 2016 Jan 1;598:184-188. doi: 10.1016/j.tsf.2015.10.081
Author
Bibtex - Download
@article{356a9ebaaae5494c9dca378386b37d51,
title = "Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films",
keywords = "Amorphous, Cu-Ti, Intrinsic stress, Sputtering, Thin film",
author = "H. Turnow and H. Wendrock and S. Menzel and T. Gemming and J. Eckert",
year = "2016",
month = jan,
day = "1",
doi = "10.1016/j.tsf.2015.10.081",
language = "English",
volume = "598",
pages = "184--188",
journal = "Thin solid films",
issn = "0040-6090",
publisher = "Elsevier",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films
AU - Turnow, H.
AU - Wendrock, H.
AU - Menzel, S.
AU - Gemming, T.
AU - Eckert, J.
PY - 2016/1/1
Y1 - 2016/1/1
KW - Amorphous
KW - Cu-Ti
KW - Intrinsic stress
KW - Sputtering
KW - Thin film
UR - http://www.scopus.com/inward/record.url?scp=84959105019&partnerID=8YFLogxK
U2 - 10.1016/j.tsf.2015.10.081
DO - 10.1016/j.tsf.2015.10.081
M3 - Article
AN - SCOPUS:84959105019
VL - 598
SP - 184
EP - 188
JO - Thin solid films
JF - Thin solid films
SN - 0040-6090
ER -
