Kamble, V. G., Patel, D. R.,
Schipfer, C.,
Thalhamer, A., Zuendel, J., Krivec, T.,
Antretter, T. &
Fuchs, P. F.,
2024,
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution