Christoefl, P.,
Jakes, J. E.,
Geier, J.,
Pinter, G.,
Oreski, G.,
Stone, D. &
Teichert, C.,
2023,
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
