Research output

  1. 2023
  2. Published

    Influence of external magnetic field on 3D electro vortex flow inside conducting liquids

    Al Nasser, M., Barati, H., Redl, C., Ishmurzin, A., Voller, N., Hackl, G., Wu, M., Ludwig, A. & Kharicha, A., 2023.

    Research output: Contribution to conferencePosterResearchpeer-review

  3. Published

    Modelling 3D Electro vortex Flow inside liquid metal and Effect of External Magnetic Fields on Flow Pattern

    Al Nasser, M., Barati, H., Redl, C., Ishmurzin, A., Voller, N., Hackl, G., Wu, M., Ludwig, A. & Kharicha, A., 2023.

    Research output: Contribution to conferencePosterResearchpeer-review

  4. Published

    On the road towards understanding squats: residual stress state of rails

    Gschwandl, T. J., Daves, W., Antretter, T., Bucher, C. & Künstner, D., 2023, In: Procedia Structural Integrity. 46, p. 17-23 7 p.

    Research output: Contribution to journalConference articlepeer-review

  5. Published

    Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens

    Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. Published
  7. Published

    Simulations of 3D Hydrogen Electric Arc and Effect of External Magnetic Field on Arc Flow Dynamics

    Al Nasser, M., Barati, H., Redl, H., Ishmurzin, A., Voller, N., Hackl, G., Wu, M., Ludwig, A. & Kharicha, A., 2023.

    Research output: Contribution to conferencePosterResearchpeer-review

  8. 2022
  9. Published
  10. Published

    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.

    Research output: Contribution to journalArticleResearchpeer-review

  11. E-pub ahead of print

    Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

    Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published
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