Method development for the reliability testing of printed circuit boards under dynamic loads

Research output: Contribution to conferencePosterResearchpeer-review

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Translated title of the contributionMethod development for the reliability testing of printed circuit boards under dynamic loads
Original languageEnglish
Publication statusPublished - 2010
Event9th Youth Symposium on Experimental Solid Mechanics - Triest, Italy
Duration: 7 Jul 201010 Jul 2010

Conference

Conference9th Youth Symposium on Experimental Solid Mechanics
Country/TerritoryItaly
CityTriest
Period7/07/1010/07/10