Integrated experimental and computational approach for residual stress investigation near through-silicon vias

Research output: Contribution to journalArticleResearchpeer-review

Authors

  • R. Hammer
  • J. Kraft
  • F. Schrank
  • O. Robach
  • J. S. Micha
  • Stefan Defregger

Details

Original languageUndefined/Unknown
JournalJournal of applied physics
Volume120
Issue number19
DOIs
Publication statusPublished - 2016