Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

Influence of environmental factors like temperature and humidity on MEMS packaging materials. / Yalagach, Mahesh; Fuchs, Peter Filipp; Mitev, Ivaylo et al.
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 2018. 8546484.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Yalagach, M, Fuchs, PF, Mitev, I, Antretter, T, Feuchter, M, Wolfberger, A & Qi, T 2018, Influence of environmental factors like temperature and humidity on MEMS packaging materials. in 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings., 8546484, Institute of Electrical and Electronics Engineers, 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546484

APA

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A., & Qi, T. (2018). Influence of environmental factors like temperature and humidity on MEMS packaging materials. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings Article 8546484 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESTC.2018.8546484

Vancouver

Yalagach M, Fuchs PF, Mitev I, Antretter T, Feuchter M, Wolfberger A et al. Influence of environmental factors like temperature and humidity on MEMS packaging materials. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers. 2018. 8546484 doi: 10.1109/ESTC.2018.8546484

Author

Yalagach, Mahesh ; Fuchs, Peter Filipp ; Mitev, Ivaylo et al. / Influence of environmental factors like temperature and humidity on MEMS packaging materials. 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 2018.

Bibtex - Download

@inproceedings{d294c95c9bb24fe7abd29bc38b5747a2,
title = "Influence of environmental factors like temperature and humidity on MEMS packaging materials.",
keywords = "hygro-thermo-mechanical simulation, hygroscopic swelling, moisture diffusion, Thermo-mechanical characterization",
author = "Mahesh Yalagach and Fuchs, {Peter Filipp} and Ivaylo Mitev and Thomas Antretter and Michael Feuchter and Archim Wolfberger and Tao Qi",
year = "2018",
month = nov,
day = "26",
doi = "10.1109/ESTC.2018.8546484",
language = "English",
booktitle = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "7th Electronic System-Integration Technology Conference, ESTC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Influence of environmental factors like temperature and humidity on MEMS packaging materials.

AU - Yalagach, Mahesh

AU - Fuchs, Peter Filipp

AU - Mitev, Ivaylo

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Wolfberger, Archim

AU - Qi, Tao

PY - 2018/11/26

Y1 - 2018/11/26

KW - hygro-thermo-mechanical simulation

KW - hygroscopic swelling

KW - moisture diffusion

KW - Thermo-mechanical characterization

UR - http://www.scopus.com/inward/record.url?scp=85060016126&partnerID=8YFLogxK

U2 - 10.1109/ESTC.2018.8546484

DO - 10.1109/ESTC.2018.8546484

M3 - Conference contribution

AN - SCOPUS:85060016126

BT - 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers

T2 - 7th Electronic System-Integration Technology Conference, ESTC 2018

Y2 - 18 September 2018 through 21 September 2018

ER -

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