Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening
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In: Acta materialia, Vol. 122.2017, No. 1 January, 02.10.2016, p. 130-137.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Grain boundary design of thin films: Using tilted brittle interfaces for multiple crack deflection toughening
AU - Daniel, Rostislav
AU - Meindlhumer, Michael
AU - Baumegger, Walter
AU - Zalesak, Jakub
AU - Sartory, Bernhard
AU - Burghammer, Manfred C.
AU - Mitterer, Christian
AU - Keckes, Jozef
PY - 2016/10/2
Y1 - 2016/10/2
KW - Nanostructured hierarchical materials
KW - Microstructure design
KW - Enhanced fracture toughness
KW - Micromechanical testing
U2 - 10.1016/j.actamat.2016.09.027
DO - 10.1016/j.actamat.2016.09.027
M3 - Article
VL - 122.2017
SP - 130
EP - 137
JO - Acta materialia
JF - Acta materialia
SN - 1359-6454
IS - 1 January
ER -