Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Standard
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. 9410862 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Harvard
APA
Vancouver
Author
Bibtex - Download
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
AU - Gschwandl, Mario
AU - Pfost, Martin
AU - Antretter, Thomas
AU - Fuchs, Peter Filipp
AU - Mitev, Ivaylo
AU - Tao, Qi
AU - Schingale, Angelika
N1 - Publisher Copyright: © 2021 IEEE.
PY - 2021/4/19
Y1 - 2021/4/19
UR - http://www.scopus.com/inward/record.url?scp=85105606837&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE52062.2021.9410862
DO - 10.1109/EuroSimE52062.2021.9410862
M3 - Conference contribution
AN - SCOPUS:85105606837
T3 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
BT - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
PB - Institute of Electrical and Electronics Engineers
T2 - 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Y2 - 19 April 2021 through 21 April 2021
ER -