Electrodeposition of copper on tantalum in liquid ammonia based electrolytes was investigated. This process approach is expected as advantageous for plating nanoscaled topographies compared to state-of-the-art process sequences where the copper is electroplated on a copper seed layer in aqueous electrolytes. The experiments were carried out in proprietary electrolytes based on liquid ammonia at room temperature inside a glove box. A working pressure of 14 bar was typically chosen. A three-electrode arrangement was applied. Self-designed planar rotating disc electrodes and recessed rotating disc electrodes were used as working electrodes. The mass transport properties and the kinetic properties of this electrochemical system were determined. Electrochemical methods and different analyses methods for example transmission electron microscopy and high resolution electron energy loss spectroscopy were applied for characterizing the system and the deposited copper layers respectively. A specific procedure to treat the tantalum prior to the electrodeposition was developed.