Development of a coating process for copper strips with appropriate lead-free solders
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Translated title of the contribution | Development of a coating process for copper strips with appropriate lead-free solders |
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Original language | English |
Title of host publication | European Metallurgical Conference EMC 2011 / Band 1 Copper; General Pyrometallurgy; Vessel Integrity; Process Gas Treatment |
Pages | 1161-1170 |
Publication status | Published - 2011 |