Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
Research output: Contribution to journal › Article › Research › peer-review
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| Translated title of the contribution | Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads |
|---|---|
| Original language | English |
| Pages (from-to) | 64-73 |
| Journal | Frattura ed Integrità Strutturale |
| Volume | 15 |
| Issue number | January |
| Publication status | Published - 2010 |
