Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process. / Macurova, K.; Bermejo Moratinos, Raul; Pletz, M. et al.
Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. 2014. p. 355-360.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Macurova, K, Bermejo Moratinos, R, Pletz, M, Schöngrundner, R, Antretter, T, Krivec, T, Morianz, M, Brizoux, M & Lecavelier, A 2014, Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process. in Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. pp. 355-360, 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014, San Diego, Austria, 13/10/14.

APA

Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., & Lecavelier, A. (2014). Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process. In Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014 (pp. 355-360)

Vancouver

Macurova K, Bermejo Moratinos R, Pletz M, Schöngrundner R, Antretter T, Krivec T et al. Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process. In Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. 2014. p. 355-360

Author

Macurova, K. ; Bermejo Moratinos, Raul ; Pletz, M. et al. / Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process. Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. 2014. pp. 355-360

Bibtex - Download

@inproceedings{15e425246d864bbf99faf0f2a57d88ff,
title = "Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process",
keywords = "Assembly process, Classical laminate theory, Fea, Interfacial model, Residual stress, Warpage",
author = "K. Macurova and {Bermejo Moratinos}, Raul and M. Pletz and R. Sch{\"o}ngrundner and T. Antretter and T. Krivec and M. Morianz and M. Brizoux and A. Lecavelier",
year = "2014",
month = jan,
day = "1",
language = "English",
isbn = "9780990902805",
pages = "355--360",
booktitle = "Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014",
note = "47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 ; Conference date: 13-10-2014 Through 16-10-2014",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

AU - Macurova, K.

AU - Bermejo Moratinos, Raul

AU - Pletz, M.

AU - Schöngrundner, R.

AU - Antretter, T.

AU - Krivec, T.

AU - Morianz, M.

AU - Brizoux, M.

AU - Lecavelier, A.

PY - 2014/1/1

Y1 - 2014/1/1

KW - Assembly process

KW - Classical laminate theory

KW - Fea

KW - Interfacial model

KW - Residual stress

KW - Warpage

UR - http://www.scopus.com/inward/record.url?scp=84925451697&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84925451697

SN - 9780990902805

SP - 355

EP - 360

BT - Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014

T2 - 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014

Y2 - 13 October 2014 through 16 October 2014

ER -

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