TY - JOUR

T1 - Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

AU - Macurova, K.

AU - Bermejo, Raul

AU - Pletz, M.

AU - Schöngrundner, Ronald

AU - Antretter, Thomas

AU - Krivec, Thomas

AU - Morianz, Mike

AU - Brizoux, Michel

AU - Lecavelier, A.

PY - 2015/4/1

Y1 - 2015/4/1

N2 - Important topics for electronic packages are thermally induced stresses created during package manufacturing and their role in mechanical failure. In the present paper, an analytical and a numerical analysis of the assembly process (component attached with an adhesive to a copper foil) is investigated. This process is prior to the lamination of the printed circuit board. Stresses develop due to a mismatch of coefficients of thermal expansion and particularly to shrinkage associated with adhesive polymerization. The analytical investigation is based on the classical laminate theory and an interfacial model. The three-dimensional, numerical, finite element model is capable of using geometric and material properties not possible to investigate analytically. In particular, the influence of the adhesive meniscus and plastic material models for copper and adhesive are investigated. The models are validated experimentally by an x-ray diffraction method (rocking-curve technique) showing a good agreement of the calculated and measured curvature radius values.

AB - Important topics for electronic packages are thermally induced stresses created during package manufacturing and their role in mechanical failure. In the present paper, an analytical and a numerical analysis of the assembly process (component attached with an adhesive to a copper foil) is investigated. This process is prior to the lamination of the printed circuit board. Stresses develop due to a mismatch of coefficients of thermal expansion and particularly to shrinkage associated with adhesive polymerization. The analytical investigation is based on the classical laminate theory and an interfacial model. The three-dimensional, numerical, finite element model is capable of using geometric and material properties not possible to investigate analytically. In particular, the influence of the adhesive meniscus and plastic material models for copper and adhesive are investigated. The models are validated experimentally by an x-ray diffraction method (rocking-curve technique) showing a good agreement of the calculated and measured curvature radius values.

U2 - 10.4071/imaps.446

DO - 10.4071/imaps.446

M3 - Article

VL - 12.2015

SP - 80

EP - 85

JO - Journal of Microelectronics and Electronic Packaging

JF - Journal of Microelectronics and Electronic Packaging

SN - 1551-4897

IS - 2

ER -