Characterization and modeling of a typical curing material for photoresist films
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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TY - GEN
T1 - Characterization and modeling of a typical curing material for photoresist films
AU - Peng, Chongnan
AU - Morak, Matthias
AU - Thalhamer, Andreas
AU - Gschwandl, Mario
AU - Fuchs, Peter
AU - Tao, Qi
AU - Krivec, Thomas
AU - Antretter, Thomas
AU - Celigueta, Miguel Angel
N1 - Publisher Copyright: © 2022 IEEE.
PY - 2022
Y1 - 2022
UR - http://www.scopus.com/inward/record.url?scp=85129509274&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE54907.2022.9758849
DO - 10.1109/EuroSimE54907.2022.9758849
M3 - Conference contribution
AN - SCOPUS:85129509274
T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
PB - Institute of Electrical and Electronics Engineers
T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Y2 - 25 April 2022 through 27 April 2022
ER -