A quinary WTaCrVHf nanocrystalline refractory high-entropy alloy withholding extreme irradiation environments

Research output: Contribution to journalArticleResearchpeer-review

Authors

  • Osman El-Atwani
  • H. T. Vo
  • Changgu Lee
  • Andrew M. Alvarado
  • N. Krienke
  • J. D. Poplawsky
  • A. A. Kohnert
  • J. Gigax
  • W. Y. Chen
  • Man Li
  • Y. Q. Wang
  • J. S. Wróbel
  • D. Nguyen-Manh
  • J. K.S. Baldwin
  • O. U. Tukac
  • E. Aydogan
  • Saryu Fensin
  • Enrique Martinez

External Organisational units

  • Los Alamos National Laboratory
  • Auburn University at Montgomery
  • Clemson University
  • University of Wisconsin-Madison
  • Department of Nuclear Engineering, University of California Berkeley
  • Oak Ridge National Laboratory (ORNL)
  • Argonne National Laboratory
  • Faculty of Materials Science and Engineering
  • Warsaw University of Technology
  • UK Atomic Energy Authority
  • University of Oxford
  • Middle East Technical University (METU)

Abstract

In the quest of new materials that can withstand severe irradiation and mechanical extremes for advanced applications (e.g. fission & fusion reactors, space applications, etc.), design, prediction and control of advanced materials beyond current material designs become paramount. Here, through a combined experimental and simulation methodology, we design a nanocrystalline refractory high entropy alloy (RHEA) system. Compositions assessed under extreme environments and in situ electron-microscopy reveal both high thermal stability and radiation resistance. We observe grain refinement under heavy ion irradiation and resistance to dual-beam irradiation and helium implantation in the form of low defect generation and evolution, as well as no detectable grain growth. The experimental and modeling results—showing a good agreement—can be applied to design and rapidly assess other alloys subjected to extreme environmental conditions.

Details

Original languageEnglish
Article number2516
Number of pages12
JournalNature Communications
Volume2023
Issue number14
DOIs
Publication statusPublished - 2 May 2023
Externally publishedYes